Columbus City Schools issues bid for Dock Ceiling Replacement

Columbus City Schools
Food Service Production Center
Dock Ceiling Replacement

LEGAL NOTICE: DOCK CEILING REPLACEMENT [br]
Sealed proposals will be received by the BOARD OF EDUCATION, City School District of Columbus, Ohio, Office of Capital Improvements, 889 E. 17th Ave, Columbus OH 43211 until Tuesday, April 26, 2016, at 2:00 PM and will be opened and read publicly immediately thereafter for the Columbus City Schools Food Service Production Center Ceiling Replacement Project #16009, according to the plans and specifications, dated April 05, 2016, prepared by Food Plant Engineering, LLC. The total estimated cost for materials and labor for Base Bid Package #100 – Dock Ceiling Replacement Contract is $50,000.00. Plans and Specifications may be secured at the bidder’s expense plus shipping costs from ARC Document Solutions, 1159 Dublin Rd, Columbus, OH 43215, (T) 614-224-5149 or www.e-arc.com/oh/columbus.  Public inspection may be made at the McGraw Hill Construction Dodge / Builders Exchange of Central Ohio Plan Room, 1175 Dublin Road, Columbus, Ohio 43215; the Minority Contractors Association, 1393 East Broad Street, Columbus, OH 43203; and Columbus City School Capital Improvements Office, 889 E. 17th Ave, Columbus OH 43211.  A pre-bid conference will be held Friday, April 18, at 2:00 PM at the following location: Columbus City Schools Food Service processing Center, 450 E. Fulton Street, Columbus OH  43215.  Inquiries concerning these plans and specifications shall be directed to Jim Larva, PH 513-619-1321, jimlarva@hendonredmond.com.  Any written addendum will be sent to all plan holders.  Each bid must be accompanied by a bid guaranty and contract bond meeting the requirements of Section 153.571 of the Ohio Revised Code. The Board of Education reserves the right to reject any or all proposals. Prevailing Wage Rates do not apply to this Invitation to Bid. By Order of the Board of Education, Gary L. Baker II, President; Stanley J. Bahorek, Treasurer.

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